Resist curable resin composition and cured article thereof

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S281100, C430S285100, C430S286100, C430S287100, C430S288100, C430S009000, C430S018000, C430S325000, C430S271100, C430S311000, C430S319000, C430S330000

Reexamination Certificate

active

10363029

ABSTRACT:
A resist curable resin material composed mainly of a curable prepolymer (for example, a photocurable resin material comprising a photosensitive prepolymer having an ethylenically unsaturated terminal group originating in an acrylic monomer (A), a compound having an ethylenically unsaturated group excluding the photosensitive prepolymer (B), and a photopolymerization initiator (C)) and a flame-retarding agent containing a hydrated metal compound and a brominated epoxy compound are mixed to produce a resist curable resin composition. Alternatively, the resist curable resin material described above and a hydrated metal compound surface-treated with a surface treating agent having an amphipathic property and a polarity are mixed to produce a resist curable resin composition.

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Machine-Assisted English Translation of JP 2000-306429 (Takanezawa et al), provided by JPO.
Full English translation of JP 2000-306429 (Takanezawa et al), provided by PTO.
Database WPI. Section Ch, Week 199239. Derwent Publications Ltd., London, GB; An 1992-320343 XP002217499 and JP 4-225079 A (Aug. 14, 1992).
Database WPI. Section Ch, Week 200120. Derwent Publications Ltd., London, GB; An 2001-193915 XP002217500 and JP 2000-306429 A (Nov. 2, 2000).

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