Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-03-27
2007-03-27
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S281100, C430S285100, C430S286100, C430S287100, C430S288100, C430S009000, C430S018000, C430S325000, C430S271100, C430S311000, C430S319000, C430S330000
Reexamination Certificate
active
10363029
ABSTRACT:
A resist curable resin material composed mainly of a curable prepolymer (for example, a photocurable resin material comprising a photosensitive prepolymer having an ethylenically unsaturated terminal group originating in an acrylic monomer (A), a compound having an ethylenically unsaturated group excluding the photosensitive prepolymer (B), and a photopolymerization initiator (C)) and a flame-retarding agent containing a hydrated metal compound and a brominated epoxy compound are mixed to produce a resist curable resin composition. Alternatively, the resist curable resin material described above and a hydrated metal compound surface-treated with a surface treating agent having an amphipathic property and a polarity are mixed to produce a resist curable resin composition.
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Machine-Assisted English Translation of JP 2000-306429 (Takanezawa et al), provided by JPO.
Full English translation of JP 2000-306429 (Takanezawa et al), provided by PTO.
Database WPI. Section Ch, Week 199239. Derwent Publications Ltd., London, GB; An 1992-320343 XP002217499 and JP 4-225079 A (Aug. 14, 1992).
Database WPI. Section Ch, Week 200120. Derwent Publications Ltd., London, GB; An 2001-193915 XP002217500 and JP 2000-306429 A (Nov. 2, 2000).
Hirata Motoyuki
Kogure Eikichi
Tamura Kenji
Yamada Ken'ichi
Lee Sin
Showa Denko K.K.
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