Resist compounds including acid labile groups having...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S326000, C430S330000, C430S905000, C430S910000, C526S286000

Reexamination Certificate

active

07147985

ABSTRACT:
A compound including a polymeric chain, an acid labile group attached to the polymeric chain, and at least one hydrophilic group attached to the acid labile group is disclosed. Compositions including the compound, and methods of using the compositions are also disclosed.

REFERENCES:
patent: 6280897 (2001-08-01), Asakawa et al.
patent: 6294309 (2001-09-01), Chang et al.
patent: 6593056 (2003-07-01), Takeda et al.
patent: 6632581 (2003-10-01), Uetani et al.
patent: 6673516 (2004-01-01), Kumon et al.
patent: 2005/0147915 (2005-07-01), Dammel
patent: 1 085 379 (2001-03-01), None
patent: 1 199 603 (2002-04-01), None
Takechi, Satoshi, et al., “Impact of 2-Methyl-2-Adamantyl Group Used for 193-nm Single Layer Resist”, Journal of Photopolymer Science and Technology, vol. 9, No. 3 (1996) pp. 475-488.
Koji Nozaki, et al. and Akiko Kotachi et al., “A Novel Polymer for A 193-nm Resist”, Journal of Photopolymer Science and Technology, vol. 9, No. 3 (1996) pp. 509-522.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resist compounds including acid labile groups having... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist compounds including acid labile groups having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist compounds including acid labile groups having... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3665044

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.