Resist composition, resist pattern forming method and compound

Details Resist composition, resist pattern forming method and compound Resist composition, resist pattern forming method and compound

2005-09-30

2010-12-14

Walke, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S905000, C430S913000

Reexamination Certificate

active

07851129

ABSTRACT:
This resist composition is a resist composition containing a compound in which a portion or all of hydrogen atoms of phenolic hydroxyl groups in a polyhydric phenol compound (a) having two or more phenolic hydroxyl groups and having a molecular weight of 300 to 2,500 are substituted with at least one selected from the group consisting of acid dissociable dissolution inhibiting groups represented by the following general formulas (p1) and (p2) wherein R1and R2each independently represents a branched or cyclic alkyl group, and may contain a hetero atom in the structure; R3represents a hydrogen atom or a lower alkyl group; and n′ represents an integer of 1 to 3.

REFERENCES:
patent: 5658706 (1997-08-01), Niki et al.
patent: 5693452 (1997-12-01), Aoai et al.
patent: 5707776 (1998-01-01), Kawabe et al.
patent: 5824451 (1998-10-01), Aoai et al.
patent: 5837420 (1998-11-01), Aoai et al.
patent: 5844057 (1998-12-01), Watanabe et al.
patent: 5994025 (1999-11-01), Iwasa et al.
patent: 6037098 (2000-03-01), Aoai et al.
patent: 6106993 (2000-08-01), Watanabe et al.
patent: 6197473 (2001-03-01), Kihara et al.
patent: 6638683 (2003-10-01), Tan et al.
patent: 7220808 (2007-05-01), Yamagishi et al.
patent: 7504196 (2009-03-01), Shiono et al.
patent: 2002/0025495 (2002-02-01), Ogata et al.
patent: 2002/0058205 (2002-05-01), Nakashima et al.
patent: 2003/0232277 (2003-12-01), Sasaki et al.
patent: 2004/0005512 (2004-01-01), Mizutani et al.
patent: 2004/0234885 (2004-11-01), Watanabe et al.
patent: 2005/0271971 (2005-12-01), Ueda et al.
patent: 2007/0259273 (2007-11-01), Shiono et al.
patent: 2007/0281243 (2007-12-01), Hirayama
patent: 2008/0020288 (2008-01-01), Hirayama et al.
patent: 2008/0145784 (2008-06-01), Shiono et al.
patent: 2009/0162781 (2009-06-01), Shiono et al.
patent: H05-061197 (1993-03-01), None
patent: H05-249681 (1993-09-01), None
patent: H06-059444 (1994-03-01), None
patent: H06-167811 (1994-06-01), None
patent: 6-266109 (1994-09-01), None
patent: 06266109 (1994-09-01), None
patent: 08-193054 (1996-07-01), None
patent: H08-220740 (1996-08-01), None
patent: H08-262712 (1996-10-01), None
patent: H08-337616 (1996-12-01), None
patent: H09-005999 (1997-01-01), None
patent: H09-160246 (1997-06-01), None
patent: A-09-211866 (1997-08-01), None
patent: H10-123703 (1998-05-01), None
patent: H10-274845 (1998-10-01), None
patent: 11-167199 (1999-06-01), None
patent: H11-153863 (1999-06-01), None
patent: H11-199533 (1999-07-01), None
patent: 2000-086584 (2000-03-01), None
patent: 2000-305270 (2000-11-01), None
patent: 2000-330282 (2000-11-01), None
patent: 2001-312055 (2001-11-01), None
patent: 2002-99088 (2002-04-01), None
patent: 2002-099089 (2002-04-01), None
patent: 2002-221787 (2002-08-01), None
patent: 2002-328473 (2002-11-01), None
patent: 2003-084437 (2003-03-01), None
patent: 2003-183227 (2003-07-01), None
patent: 2003-260881 (2003-09-01), None
patent: 2004-062049 (2004-02-01), None
patent: 2004-125835 (2004-04-01), None
patent: 2004-151605 (2004-05-01), None
patent: 2004-191913 (2004-07-01), None
patent: 2004-302440 (2004-10-01), None
patent: 2004-359590 (2004-12-01), None
patent: 2002-055452 (2005-02-01), None
patent: 2005-089387 (2005-04-01), None
patent: 2005-091909 (2005-04-01), None
patent: 2005-309421 (2005-11-01), None
patent: 0231242 (1997-05-01), None
patent: 2001-0088341 (2001-09-01), None
patent: 10-0406242 (2003-11-01), None
patent: 200302397 (2003-08-01), None
patent: 200617602 (2006-06-01), None
patent: WO 2006/046383 (2006-05-01), None
Machine translation of JP 06-266109 (no date).
Office Action issued Sep. 16, 2008 on the counterpart Korean Patent Application No. 10-2007-7010473.
International Search Report from PCT/JP2005/018143 dated Nov. 15, 2005.
Hirayama et al, “Development of Amorphous PolyPhenol Resists with Low Molecular Weight and Narrow Dispersion for EB Lithography”, IEEE Xplore, Oct. 22, 2004, pp. 10-11.
Hirayama et al. “Development of Electron Beam Resists Based on Amorphous Polyphenols with Low Molecular Weight and Narrow Dispersion” Proceedings of SPIE vol. 5753, p. 738-745 (2005).
Hirayama et al., Journal of Photopolymer Science and Technology, vol. 17, No. 3, 435-440, (2004).
Notice of Allowance issued on corresponding Japanese Patent Application No. 2004-260764, dated Feb. 16, 2010.
Office Action issued in corresponding U.S. Appl. No. 10/590,046, dated Mar. 17, 2010.
Office Action issued in corresponding U.S. Appl. No. 10/590,046, dated Sep. 21, 2009.
Office Action issued in corresponding U.S. Appl. No. 10/590,046, dated Apr. 24, 2009.
Office Action issued in corresponding U.S. Appl. No. 10/590,046, dated Sep. 26, 2008.
Office Action issued in corresponding U.S. Appl. No. 11/572,630, dated Mar. 1, 2010.
Office Action issued in corresponding U.S. Appl. No. 11/572,630, dated Aug. 13, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/572,630, dated Apr. 23, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/572,630, dated Sep. 25, 2008.
Office Action issued in corresponding U.S. Appl. No. 11/574,805 dated Feb. 26, 2010.
Office Action issued in corresponding U.S. Appl. No. 11/574,805 dated Aug. 4, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/574,805 dated May 19, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/574,805 dated Aug. 19, 2008.
Office Action issued in corresponding U.S. Appl. No. 11/574,805 dated Feb. 10, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/813,511, dated Apr. 28, 2010.
Office Action issued in corresponding U.S. Appl. No. 11/813,511, dated Oct. 8, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/884,748, dated Jul. 7, 2008.
Office Action issued in corresponding U.S. Appl. No. 11/914,451 dated May 3, 2010.
Office Action issued in corresponding U.S. Appl. No. 11/914,451 dated Oct. 8, 2009.
Office Action issued in corresponding U.S. Appl. No. 11/917,458, dated Apr. 5, 2010.
Office Action issued in corresponding U.S. Appl. No. 11/994,602, dated Mar. 8, 2010.
International Search Report issued in corresponding PCT application no. PCT/JP2006/302271, mailed on Mar. 7, 2006.
International Search Report issued in corresponding PCT application No. PCT/JP2006/313103, dated Sep. 26, 2006.
International Search Report issued in corresponding PCT Application No. PCT/JP2006/311443, dated Jun. 7, 2006.
International Search Report issued in corresponding PCT application No. PCT/JP2006/301679, Feb. 16, 2006.
International Search Report issued in corresponding PCT application No. PCT/JP2005/013564, mailed Sep. 6, 2005.
Office Action issued on counterpart Japanese Patent Application No. 2004-182300, dated May 27, 2008.
Office Action issued on the counterpart Japanese Patent Application No. 2004-182301, dated Aug. 26, 2008.
Office Action issued on the counterpart Japanese Patent Application No. 2004-182301, dated Jun. 3, 2008.
Office Action issued on the counterpart Korean Patent Application No. 10-2007-7019433, dated Jun. 5, 2008.
Office Action issued in counterpart Japanese Patent Application No. 2005-026266, dated Mar. 3, 2009.
Office Action issued in counterpart Korean Patent Application No. 10-2007-7017441, dated May 7, 2009.
Office Action issued on Apr. 14, 2008 on the counterpart Korean Patent Application No. 10-2007-7004390.
Office Action and Search Report issued on May 12, 2008, on the counterpart Taiwanese Patent Application No. 094104523.
Yamaguchi et al.,Linewidth fluctuations caused by polymer aggregates in resist films, Journal of Photopolymer Science and Technology, vol. 10, No. 4, pp. 635-640, (1997).
Office Action issued in counterpart Japanese Patent Application No. JP 2005-050721, dated Jul. 28, 2009.
Office Action issued in counterpart Japanese Patent Application No. JP 2004-260764, dated Mar. 3, 2009.
Office Action issued in counterpart Japanese Patent Application No. JP 2005-050721, dated Mar. 3, 2009.
Office Action issued in Korean Patent Application No. 10-2007-7004390, dated Dec. 17, 2008.
Office Action issued in Korean Patent Application No. 10-2008-7025851, dated Jan. 7, 2009.
Decision to Grant a Patent issue

Affiliated with

Also associated with

Rating

Resist composition, resist pattern forming method and compound does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist composition, resist pattern forming method and compound, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist composition, resist pattern forming method and compound will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4203921