Resist composition and patterning process using the same

Details Resist composition and patterning process using the same Resist composition and patterning process using the same

2005-12-19

2008-12-02

Lee, Sin J. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S311000, C430S319000, C430S325000, C430S326000, C430S905000, C430S910000, C430S914000, C430S921000, C430S925000

Reexamination Certificate

active

07459261

ABSTRACT:
There is disclosed a resist composition which comprises, at least, a polymer in which a sulfonium salt having a polymerizable unsaturated bond, a (meth)acrylate having a lactone or a hydroxyl group as an adhesion group, and a (meth)acrylate having an ester substituted with an acid labile group are copolymerized. There can be provided a resist composition with high resolution which has high sensitivity and high resolution to high energy beam, especially to ArF excimer laser, F2excimer laser, EUV, X-ray, EB, etc., has reduced line edge roughness, and comprises a polymeric acid generator which has insolubility in water, and sufficient thermal stability and preservation stability.

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Dammel et al; “193 nm Immersion Lithograph—Taking the Plunge”; Journal of Photopolymer Science and Technology; vol. 17; No. 4 (2004); pp. 587-601.
Gonsalves et al.; “High Resolution Resists for Next Generation Lithography: The Nanocomposite Approach”; Mat. Res. Sco. Symp. Prov.; vol. 636; 2001 Materials Research Society; 12 pp.

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