Resist composition and patterning process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S325000, C430S326000, C430S311000, C430S313000, C430S907000

Reexamination Certificate

active

07550247

ABSTRACT:
A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing an organic group having a hydroxyl group and having at least 3 fluorine atoms, in total, on a proximate carbon atom, an organic group having a carboxyl group protected with an acid labile group, and a lactone ring-bearing organic group, respectively. The resist composition has satisfactory resolution and overcomes the problem of a low selective etching ratio between resist film and organic film during oxygen reactive etching.

REFERENCES:
patent: 5714625 (1998-02-01), Hada et al.
patent: 5902713 (1999-05-01), Hada et al.
patent: 5972560 (1999-10-01), Kaneko et al.
patent: 6004724 (1999-12-01), Yamato et al.
patent: 6022666 (2000-02-01), Hada et al.
patent: 6063953 (2000-05-01), Hada et al.
patent: 6261738 (2001-07-01), Asakura et al.
patent: 6309796 (2001-10-01), Nakashima et al.
patent: 6730453 (2004-05-01), Nakashima et al.
patent: 6908722 (2005-06-01), Ebata et al.
patent: 2002/0085165 (2002-07-01), Fukumoto et al.
patent: 2003/0224286 (2003-12-01), Barclay et al.
patent: 2005/0079443 (2005-04-01), Noda et al.
patent: 2006/0073413 (2006-04-01), Takemura et al.
patent: 1422565 (2004-05-01), None
patent: 9-95479 (1997-04-01), None
patent: 9-208554 (1997-08-01), None
patent: 9-230588 (1997-09-01), None
patent: 9-301948 (1997-11-01), None
patent: 10-324748 (1998-12-01), None
patent: 2906999 (1999-04-01), None
patent: 11-302382 (1999-11-01), None
patent: 2000-314956 (2000-11-01), None
patent: 2001-215714 (2001-08-01), None
patent: 2002-55346 (2002-02-01), None
patent: 2002-220471 (2002-08-01), None
patent: 2002-268227 (2002-09-01), None
patent: 2003-173027 (2003-06-01), None
Machine-assisted English translation of JP 2002-268227 as provided by JPO.
Ito et al., Journal of Photopolymer Science and Technology, vol. 15, No. 4 (2002), pp. 591-602.
Arimitsu et al., Journal of Photopolymer Science and Technology, vol. 8, No. 1 (1995), pp. 43-44.
Kudo et al., Journal of Photopolymer Science and Technology, vol. 8, No. 1 (1995), pp. 45-46.
Arimitsu et al., Journal of Photopolymer Science and Technology, vol. 9, No. 1 (1995), pp. 29-30.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resist composition and patterning process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist composition and patterning process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist composition and patterning process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4106984

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.