Resist composition and patterning process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S326000, C430S330000, C430S907000, C430S910000, C430S919000, C430S920000

Reexamination Certificate

active

07598016

ABSTRACT:
To a resist composition comprising a polymer which changes its alkali solubility under the action of an acid as a base resin, is added a copolymer comprising recurring units containing a carboxylic acid ammonium salt and recurring units containing at least one fluorine atom as an additive. The composition is suited for immersion lithography.

REFERENCES:
patent: 5714625 (1998-02-01), Hada et al.
patent: 6004724 (1999-12-01), Yamato et al.
patent: 6063953 (2000-05-01), Hada et al.
patent: 6261738 (2001-07-01), Asakura et al.
patent: 6512020 (2003-01-01), Asakura et al.
patent: 6767688 (2004-07-01), Teng et al.
patent: 6916591 (2005-07-01), Ohsawa et al.
patent: 7122005 (2006-10-01), Shusterman
patent: 2008/0032202 (2008-02-01), Ishizuka et al.
patent: 2008/0153030 (2008-06-01), Kobayashi et al.
patent: 9-95479 (1997-04-01), None
patent: 9-230588 (1997-09-01), None
patent: 9-301948 (1997-11-01), None
patent: 2906999 (1999-04-01), None
patent: 2000-314956 (2000-11-01), None
patent: WO 2004/074242 (2004-09-01), None
patent: 2005-264131 (2005-09-01), None
Lin, B.J. “Semiconductor Foundry, Lithography, and Partners” Proc. Spie vol. 4690, pp. xxix-xlii.
Owa, et. al. “Immersion lithography; its potential performance and issues”, Proceedings of SPIE, vol. 5040 (2003), pp. 724-733.
Hirayama, Taku, “Resist and Cover Material Investigation for Immersion Lithography”, 2nd Immersion Workshop (2003).
Nakano, et al. “Defectivity data taken with a full-field immersion exposure tool”, 2nd International symposium on Immersion Lithography, Sep. 12-15, 2005.
Arimitsu, et al. “Sensitivity Enhancement of Chemical-Amplification-Type Photoimaging Materials by Acetoacetic Acid Derivatives”, Journal of Photopolymer Science and Technology, vol. 8, No. 1 (1995) pp. 43-46.
Arimitsu, et al. “effect of Phenolic Hydroxyl Residues on the Improvement of Acid-Proliferation-Type Photoimaging Materials”, Journal of Photopolymer Science and Technology, vol. 9, No. 1 (1996) pp. 29-30.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resist composition and patterning process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist composition and patterning process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist composition and patterning process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4081203

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.