Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-08-30
2011-08-30
Walke, Amanda C. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S311000, C430S913000
Reexamination Certificate
active
08007981
ABSTRACT:
A resist composition of the present invention is obtained by dissolving a resin component (A) that displays changed alkali solubility under action of acid and an acid generator component (B) that generates acid upon exposure in an organic solvent (S), wherein the organic solvent (S) includes an aromatic organic solvent (S1). According to the present invention, a resist composition and a method of forming a resist pattern, in which the level of LWR is reduced, can be provided.
REFERENCES:
patent: 5258257 (1993-11-01), Sinta et al.
patent: 5853949 (1998-12-01), Kodama et al.
patent: 5945517 (1999-08-01), Nitta et al.
patent: 6054254 (2000-04-01), Sato et al.
patent: 6103443 (2000-08-01), Wanat et al.
patent: 6153733 (2000-11-01), Yukawa et al.
patent: 6214748 (2001-04-01), Kobayashi et al.
patent: 6228552 (2001-05-01), Okino et al.
patent: 6358804 (2002-03-01), Kobayashi et al.
patent: 6731857 (2004-05-01), Shelnut et al.
patent: 6787286 (2004-09-01), Szmanda et al.
patent: 6906851 (2005-06-01), Yuasa
patent: 6991888 (2006-01-01), Padmanaban et al.
patent: 7084236 (2006-08-01), Duineveld et al.
patent: 7205087 (2007-04-01), Kavanagh et al.
patent: 7316884 (2008-01-01), Ansai et al.
patent: 7329479 (2008-02-01), Itoh et al.
patent: 7396637 (2008-07-01), Itou et al.
patent: 7494762 (2009-02-01), Irie et al.
patent: 7601480 (2009-10-01), Rahman et al.
patent: 2002/0015906 (2002-02-01), Lee et al.
patent: 2003/0180662 (2003-09-01), Nakano
patent: 2004/0110085 (2004-06-01), Iwai et al.
patent: 2006/0054589 (2006-03-01), Omori et al.
patent: 2006/0098926 (2006-05-01), Shelnut et al.
patent: 2006/0145163 (2006-07-01), Tsujimura et al.
patent: 2007/0172674 (2007-07-01), Nozaki et al.
patent: 2008/0187860 (2008-08-01), Tsubaki et al.
patent: 0 834 770 (1998-04-01), None
patent: 05-249673 (1993-09-01), None
patent: H09-208554 (1997-08-01), None
patent: 10-142799 (1998-05-01), None
patent: 10-186647 (1998-07-01), None
patent: H11-035551 (1999-02-01), None
patent: H11-035552 (1999-02-01), None
patent: H11-035573 (1999-02-01), None
patent: 11-72925 (1999-03-01), None
patent: H11-322707 (1999-11-01), None
patent: A-2000-136165 (2000-05-01), None
patent: 2001-294814 (2001-10-01), None
patent: 2002-53618 (2002-02-01), None
patent: 2003-241385 (2003-08-01), None
patent: 2003-253212 (2003-09-01), None
patent: 2003-344994 (2003-12-01), None
patent: A-2006-018017 (2006-01-01), None
patent: A-2006-113135 (2006-04-01), None
patent: WO 2004/074242 (2004-09-01), None
Machine translation of JP 2003-344994 (no date).
International Search Report in connection with corresponding PCT application No. PCT/JP2006/313710, dated Aug. 15, 2006.
Office Action issued in corresponding Japanese Patent Application No. 2005-225805, dated Jan. 11, 2011.
Iwai Takeshi
Seshimo Takehiro
Watanabe Ryoji
Knobbe Martens Olson & Bear LLP
Tokyo Ohka Kogyo Co. Ltd.
Walke Amanda C.
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