Resist composition, a process for forming a resist pattern and a

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430910, 430905, 430909, 430325, 430326, G03C 1492

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active

059103922

ABSTRACT:
The present invention discloses a chemically amplified resist composition that is able to form a resist pattern that can be exposed in short wavelength regions, has good transparency, sensitivity, dry-etch resistance and resolution, while also exhibiting excellent adhesion to the substrate. This chemically amplified resist composition comprises: the combination of a base resin comprised of a polymer that is itself insoluble in a basic aqueous solution and contains at least (A) a monomer unit I having carboxylic acid or phenol protected with a specific protective group, and (B) a monomer unit II having an ester group or ether group that contains a cyclic carbonate structure, and can become soluble in a basic aqueous solution when the protective group of the monomer unit I is deprotected by the effect of the acid; and, a photo acid generator capable of generating an acid that can provoke deprotection of the protective group of monomer unit I when decomposed by absorption of imaging radiation.

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Yuko Kaimoto et al.; Proc. SPIE--vol. 1672; pp. 66-73; 1992.
Makoto Takahashi et al.; Proc. SPIE--vol. 2438; pp. 422-432; 1995.
Koji Nozaki et al.; Chem. Mater--vol. 6, pp. 1492-1498; 1994.
Koji Nozaki et al.; Jpn. J. Appl. Phys.--vol. 35, pp. L528-L530; 1996.
Koji Nazaki et al.; Journal of Photopolymer Science and Technology; vol. 9, No. 3, pp. 509-522; 1996.
Satoshi Takechi et al.; Journal of Photopolymer Science and Technology, vol. 9, No. 3, pp. 475-488; 1996.

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