Resist application method and device

Details Resist application method and device Resist application method and device

2006-05-30

2006-05-30

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S005000, C438S780000, C438S781000

Reexamination Certificate

active

07053008

ABSTRACT:
The resist application method comprises the steps of: thermal processing for evaporating water from the surface of a wafer10; making the surface of the wafer10hydrophobic with a hydrophobic processing material; and applying a resist onto the wafer10, and the step of thermal processing to the step of making the surface of the wafer10hydrophobic are performed in a dehumidified atmosphere.

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