Resin-shield type semiconductor device

Details Resin-shield type semiconductor device Resin-shield type semiconductor device

2000-04-25

2001-09-04

Clark, Sheila V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S659000, C257S704000

Reexamination Certificate

active

06285087

ABSTRACT:

FIELD OF THE TECHNOLOGY
The present invention relates to a resin-shield type semiconductor device and a method of the production thereof.
BACKGROUND OF THE INVENTION
There are some products, having generally the same size as that of a semiconductor chip, in a semiconductor device formed by shielding the semiconductor chip with resin. In such a semiconductor device, a surface of the semiconductor chip on which electrode terminals are formed is shielded and external connection terminals are arranged thereon for connecting the chip to a circuit board so that the resultant device has the same size as that of the semiconductor chip (chip scale).
FIG. 14
shows a sectional view of a prior art semiconductor device having a chip size, in which the connection between a lead
34
and an electrode terminal
12
of a semiconductor chip
10
and the support for an external connection terminal (solder ball)
40
are illustrated. This semiconductor device is structured as follows:
An insulating member
20
is adhered onto a surface
10
a
of the semiconductor chip
10
on which the electrode terminal
12
is formed, without covering the electrode terminal
12
. The insulating member
20
has a main layer of elastomer
22
and is adhered to the semiconductor
10
via an adhesive
24
. A circuit pattern
30
has a land
32
at one end for the connection to the external connection terminal, and a lead
34
which is a conductive layer at the other end. The circuit pattern
30
is supported by an insulating film
36
which constitutes, together with the circuit pattern
30
, a tape substrate
38
. The tape substrate
38
is adhered to the insulating member
20
in the land
32
and connected to the electrode terminal
12
in the lead
34
by a bonding.
After the lead
34
is bonded, an exposed portion of the lead
34
and the electrode terminal
12
is shielded with resin
90
. The circuit pattern
30
is adhered to the insulating film
36
by an adhesive
35
. The external connection terminal is a solder ball
40
or the like and is connected to the land
32
.
To constitute the above-mentioned lamination, first, the tape substrate
38
is formed, to which the elastomer
22
carrying the adhesive layer
24
is then adhered. With such an adhesive layer
24
the semiconductor chip
10
is adhered (see
FIG. 2
in which a production method is illustrated).
FIG. 15
shows the bonding of the lead
34
to the electrode terminal
12
. When the lead
34
is bonded, as illustrated, a bonding tool
91
comes into contact with a top surface of the lead
34
and pricks the lead
34
supported by the insulating film
36
, while pushing the lead
34
by a front end of the bonding tool
91
. The lead
34
is bent thereby to be in contact with the electrode terminal
12
and is bonded thereto. According to this bonding operation, the lead
34
is curved from the tape substrate
38
toward the electrode terminal
12
as illustrated. The bonding operation of the bonding tool
91
is a hot-press bonding while using ultrasound or another method.
FIG. 16
is an enlarged perspective view of the semiconductor chip
10
on which the tape substrate
38
is arranged. The lead
34
is supported to bridge over a window
36
a
provided in the insulating film
36
. The tape substrate
38
is positioned so that the electrode terminal
12
of the semiconductor chip
10
is exposed in correspondence to the window
36
a
and the lead
34
is located above the respective electrode terminal
12
. After the bonding tool
91
is pushed down from a position above a cutting point of the lead
34
and cuts the lead
34
, the bonding tool
91
slides from the cutting point down to the electrode
12
(bonding point) to bond the lead
34
to the electrode terminal
12
. The bonding operation is carried out by the bonding tool
91
, one by one, on all the leads
34
as illustrated.
In the prior art, after the lead
34
is bonded as described above, a resin is coated along the outer edge of the semiconductor chip
10
through a dispenser to shield the exposed portions of the lead
34
and the electrode terminal
12
.
However, in this prior art, it is difficult to properly coat the shield resin since the width of the area to be shielded is small. Further, to obtain a favorable finish, it is necessary to carry out the shielding operation at a lower speed to avoid dropping the resin, which results in a deterioration in productivity.
If the resin is not sufficiently coated, a cut end
34
a
or a shoulder
34
b
of the lead
34
may be exposed to lower the reliability of the resultant semiconductor device.
On the other hand, if the shield resin is excessively applied, the outer dimensions of the product become improper for the handling in the subsequent process.
Also, since a corner
10
c
of the semiconductor chip
10
is exposed and liable to chip off (chipping), the handling thereof is difficult.
DISCLOSURE OF THE INVENTION
Accordingly, an object of the present invention is to provide a semiconductor device, and a method for producing the same, improved in productivity and capable of assuredly shielding exposed portions of leads or others and avoiding chipping.
To achieve the above object, according to the present invention, a resin shield type semiconductor device is provided, comprising a semiconductor chip having an electrode terminal on an electrode terminal-forming surface, an insulating member adhered onto the electrode terminal-forming surface of the semiconductor chip without covering the electrode terminal, a circuit pattern having at one end a terminal to be connected to an external connection terminal, provided on the insulating member, and at the other end a lead to be connected to the electrode terminal, a cover member having an outer size larger than that of the semiconductor chip to cover not only the electrode terminal-forming surface and the lead but also the outer edge of the semiconductor, and a resin shield for shielding the electrode terminal-forming surface, lead and a side surface of the semiconductor chip, formed by filling a sealant into a gap between the cover member and the electrode terminal-forming surface and curing the sealant.
Preferably, the outer side surface of the resin shield is defined by cutting the same at a position outside of the outer edge of the semiconductor chip.
The insulating member is preferably an elastomer to allow it to absorb the difference in the thermal expansion coefficient between the circuit board and the semiconductor chip, resulting in an improvement in the reliability of the resultant product.
The circuit pattern is adhered to an insulating film and the lead initially bridging over an opening formed in the insulating film is pushingly cut by a bonding tool and bonded to the electrode terminal, whereby a chip-size semiconductor device is effectively produced.
The lead is connected to the electrode terminal provided on the outer edge of the semiconductor chip, and part of the insulating film located outside of an area wherein the lead is provided and the lead left in the insulating film define an outer edge corner of the resin shield, whereby the semiconductor device is suitably positioned, for example, when it is inserted into a test socket.
The lead is connected to the electrode terminal arranged in a central region of the semiconductor chip and the insulating film arranged outer than the semiconductor chip defines the outer edge corner of the resin shield, whereby even a semiconductor device of a center-row type is suitably positioned, for example, when it is inserted into a test socket.
According to another aspect, a resin shield type semiconductor device is provided, comprising a semiconductor chip having a plurality of electrode terminals on an electrode terminal-forming surface, a first insulating member adhered to the electrode terminal-forming surface without covering the electrode terminals, a first circuit pattern having at one end a first terminal to be connected to an external connection terminal, provided on the first insulating member, and at the other end a lead to be

Affiliated with

Also associated with

Rating

Resin-shield type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-shield type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-shield type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2453088