Resin sealing-type semiconductor device and method for...

Details Resin sealing-type semiconductor device and method for... Resin sealing-type semiconductor device and method for...

2006-02-14

2006-02-14

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C438S015000, C438S017000, C438S108000, C438S118000, C257S685000, C257S687000, C257S783000, C257S778000

Reexamination Certificate

active

06998701

ABSTRACT:
A resin sealing-type semiconductor device comprises a first semiconductor chip15with a large amount of heat generation, whose external electrode leading-out bonding pads16are wire-bonded to respective outer leads25A and a second semiconductor chip17smaller in the amount of heat generation than the first semiconductor chip, whose external electrode leading-out bonding pads18are wire-bonded to respective outer leads25A, wherein the first semiconductor chip15is molded by a high thermal conductive resin28, and the second semiconductor chip17and the first semiconductor chip15molded by the high thermal conductive resin are integrally molded by a non-high thermal conductive resin31. A method includes manufacturing the resin sealing-type semiconductor device.

REFERENCES:
patent: 6589802 (2003-07-01), Asada et al.
patent: 6627997 (2003-09-01), Eguchi et al.

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