Resin sealing method for electronic part and mold used for...

Details Resin sealing method for electronic part and mold used for... Resin sealing method for electronic part and mold used for...

2004-12-22

2009-11-17

Lee, Edmund H. (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S272170, C264S275000

Reexamination Certificate

active

07618573

ABSTRACT:
An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.

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