Resin-sealed type semiconductor device

Details Resin-sealed type semiconductor device Resin-sealed type semiconductor device

1996-02-12

1997-12-30

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257787, 257666, H01L 23495, H01L 2348, H01L 2328

Patent

active

057034079

ABSTRACT:
In the resin-sealed type semiconductor device of the present invention, the inner lead is adhered onto the semiconductor element via the insulating tape, and electrically connected to the semiconductor element. The inner lead, the insulating tape and the semiconductor element are sealed by resin in a package. The outer lead is integrated with the inner lead to form a step, formed thicker than that of the inner lead, and has an exposed surface in the same plane as the upper surface of the package.

REFERENCES:
patent: 5406124 (1995-04-01), Morita et al.
patent: 5493151 (1996-02-01), Asada et al.

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