Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2011-05-31
2011-05-31
Smith, Bradley K (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S692000, C257S686000
Reexamination Certificate
active
07952177
ABSTRACT:
A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
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Fukuda Toshiyuki
Kawasaki Tomoki
Ogata Shuichi
Yamada Yuichiro
Karimy Mohammad T
McDermott Will & Emery LLP
Panasonic Corporation
Smith Bradley K
LandOfFree
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