Resin-sealed semiconductor device and lead frame used in a resin

Details Resin-sealed semiconductor device and lead frame used in a resin Resin-sealed semiconductor device and lead frame used in a resin

1995-10-12

1997-07-15

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257692, 257676, 257737, H01L 23495

Patent

active

056486820

ABSTRACT:
In a resin-sealed semiconductor device, leads are respectively connected to a plurality of connection electrodes of a semiconductor chip. The leads include a plurality of inner leads respectively connected to the connection electrodes and a plurality of outer leads, first ends of which are connected to the inner leads and second ends of which are connected to an external device. Distal ends of the inner leads have cut-off thin portions, which define a recess for holding the semiconductor chip. The inner leads and the semiconductor chip are covered by a resin sealing material.

REFERENCES:
patent: 4701363 (1987-10-01), Barber
patent: 4707418 (1987-11-01), Takiar et al.
patent: 5349238 (1994-09-01), Ohsawa et al.

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