Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1994-09-20
1996-07-23
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257714, 257706, 257717, 361704, 361714, H01L 2322, H01L 2324
Patent
active
055392539
ABSTRACT:
A resin-sealed semiconductor device includes a heat sink on which a semiconductor chip is provided. An output terminal is connected to the semiconductor chip. A casing surrounds the chip and part of the output terminal. The inside of the casing is filled with a sealing resin containing an aggregate such as glass particle. The chip is mounted in the area of an upper surface of the heat sink and the remaining area is covered with an epoxy resin film, which is from 10 .mu.m to 20 .mu.m thick. The resin film increases the bonding strength between the sealing resin and the heat sink and prevents the sealing resin from peeling away from the heat sink upon heat cycles due to different expansion coefficients.
REFERENCES:
patent: 4788626 (1988-11-01), Neidig et al.
patent: 4916502 (1990-04-01), Oshima
patent: 4920405 (1990-04-01), Itoh et al.
patent: 5172215 (1992-12-01), Kobayashi et al.
Fuji Electric & Co., Ltd.
Hille Rolf
Ostrowski David
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