Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

1995-06-22

1997-02-25

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257787, 257701, 257702, 257792, H01L 2329, H01L 2328, H01L 23053, H01L 2314

Patent

active

056062044

ABSTRACT:
Disclosed is a resin-sealed semiconductor device which has an insulation substrate 1 having a chip-mounting portion is, leads which are radially disposed around the chip-mounting portion, an IC chip mounted on the chip-mounting portion and connected electrically with inner portions of the leads, a resin which seals over an area which includes the IC chip and the inner leads and does not include a peripheral portion of the insulation substrate and the outer leads, and outer portion of terminals which are electrically connected with the outer leads which are left out of the resin.

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