Resin sealed ceramic package and semiconductor device

Details Resin sealed ceramic package and semiconductor device Resin sealed ceramic package and semiconductor device

1998-04-27

2000-05-09

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

757729, H01L 2304

Patent

active

060607793

ABSTRACT:
A resin sealing ceramic package 10 for resin sealing of a semiconductor element 14 mounted in a cavity 16, the ceramic package having a bleed-out-preventing metal pattern 24, to prevent bleed-out of a sealing resin filled in the cavity 16 from out of the cavity, which comprises a metallized layer 26 made of tungsten formed in a frame-shape on the surface of the ceramic package 10 along the edges of the cavity 16, and a metal plating layer 32 consisting of a nickel layer 28 of at least 1.5 .mu.m thickness and a gold layer 30 of at least 0.3 .mu.m thickness formed on the metallized layer 26.

REFERENCES:
patent: 4796083 (1989-01-01), Cherukuri et al.
patent: 5055911 (1991-10-01), Ogata

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