Resin molding machine and resin tablet feeding machine

Details Resin molding machine and resin tablet feeding machine Resin molding machine and resin tablet feeding machine

2001-04-20

2004-11-09

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

With interposed non-adhering web or sheet type parting means

C425S116000, C425S126100, C425S182000, C425S190000

Reexamination Certificate

active

06814556

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a resin molding machine, in which a loader conveys a work piece from a work piece feeding unit to a press unit and an unloader conveys a molded product from the press unit to a product accommodating unit, and a resin tablet feeding machine, in which sending resin tablets by vibrating a tablet container.
Conventional resin molding machines for molding semiconductor devices will be explained with reference to
FIGS. 20 and 21
. In
FIG. 20
, the conventional resin molding machine includes: a press unit
202
having a molding die
201
; a work piece feeding unit
205
feeding work pieces, e.g., lead frames, substrates, accommodated in feeding magazines
203
to a feeding table
204
; a storing unit
206
storing the resin tablets; a resin tablet feeding unit
210
having a bowl feeder
207
and a linear feeder
208
, which form the resin tablets in line and feed in a prescribed direction, and feeding tablet holders
209
, in which the resin tablets are respectively set, to the feeding table
204
; a degating unit
211
removing disused resin from molded products, which are taken out from the molding die
201
; a product accommodating unit
213
having accommodating magazines
212
, in which the molded products, from which the disused resin is removed, are accommodated; and a control unit
214
controlling the whole machine.
When the work pieces and the resin tablets are supplied onto the feeding table
204
, they are held by a loader
215
and conveyed to the molding die
201
, which has been opened. On the other hand, when the molded products are ejected from the molding die
201
, they are held by an unloader
216
and conveyed to the degating unit
211
. At that time, the unloader
216
cleans parting faces of the molding die
201
. The unloader
216
holds and presses substrates of the molded products, and they are cooled by air so as to prevent deformation of the substrates in the degating unit
211
. In the degating unit
211
, the substrates are twisted to remove the disused resin, so the unloader
216
leaves the molded products, from which the disused resin is removed, and returns to take out next products. The loader
215
and the uunloader
216
are moved along a common guide rail
217
, which is provided above the press unit
202
. Namely, the loader
215
is reciprocatively moved between the feeding table
204
and the molding die
201
; the unloader
216
is reciprocatively moved between the molding die
201
and the degating unit
211
. The conventional resin molding unit was disclosed in a Japanese Patent Gazette No. 3-286817.
In
FIG. 21
, the conventional resin molding machine has a plurality of press units
222
a
-
222
d
, which respectively have molding dies
221
a
-
221
d
, and they are detachably attached to attaching sections
224
of a base unit
223
so as to change number of products and kinds of products. The base unit
233
includes: a work piece feeding unit
227
feeding work pieces, e.g., lead frames, substrates, accommodated in feeding magazines
203
to a turn table
226
; a resin tablet feeding unit
230
feeding the resin tablets from tablet cassettes
228
and setting the resin tablets in a tablet holder
229
; a degating unit
232
removing disused resin from molded products, which are taken out from the press units
222
a
-
222
d
and held by a pick-up
231
; and a product accommodating unit
234
having accommodating magazines
233
, in which the molded products, from which the disused resin is removed, are accommodated.
When the work pieces and the resin tablets are supplied into the molding dies
221
a
-
221
d
, they are held by a loader
236
of a loader unit
235
and conveyed to the molding dies
221
a
-
221
d
, which have been opened. On the other hand, when the molded products are ejected from the molding dies
221
a
-
221
d
, they are held by an unloader
237
of the loader unit
235
and conveyed to the degating unit
232
. At that time, the unloader
237
cleans parting faces of the molding dies
221
a
-
221
d
. The loader
236
and the unloader
237
are vertically arranged in the loader unit
235
and moved along a common guide rail
238
of the base unit
223
. The loader
236
and the unloader
237
can be moved independently.
The loader
236
turns at a position “O” to take the work pieces from the turn table
226
and take the resin tablets from the tablet holder
229
. The loader
236
is turned to head the molding dies
221
a
-
221
d
, then the loader
236
is moved to a position “M” or “N”, along the guide rail
238
, so as to feed the work pieces and the resin tablets to the assigned press unit. On the other hand, the unloader
237
has waited at the position “M” or “N”, then the unloader
237
takes out the ejected products from the opened dies
221
a
-
221
d
of the press units
222
a
-
222
d
. Further, the unloader
237
is moved to a position “O” along the guide rail
238
, then the unloader
237
is turned to head a degating unit
232
, if necessary, to transfer the products thereto. After the unloader
237
takes out the products from the opened dies
221
a
-
221
d
of the press units
222
a
-
222
d
, the loader
236
enters the opened dies
221
a
-
221
d
instead of the unloader
237
so as to set next work pieces and next resin tablets in the molding dies
221
a
-
221
d
. The conventional resin molding unit was disclosed in a Japanese Patent Gazette No. 10-58457.
These days, semiconductor devices are made compact and highly integrated with fine wires. Further, in some semiconductor devices, parts of leads are projected from a package section and connecting portions, which will be connected to terminals, e.g., bumps, solder balls, are exposed. In these cases, parting faces of a molding dies of a press unit is covered with release film, which is supplied and collected by a film unit. A conventional resin molding machine having the film unit will be explained with reference to
FIGS. 22 and 23
.
As shown in
FIG. 22
, the conventional resin molding machine includes: a press unit
242
having a molding die
241
; a work piece feeding unit
245
feeding work pieces, e.g., lead frames, substrates, accommodated in feeding magazines
243
to a feeding table
244
; a storing unit
246
storing the resin tablets; a resin tablet feeding unit
250
having a bowl feeder
247
and a linear feeder
248
, which form the resin tablets in line and feed in a prescribed direction, and feeding tablet holders
249
, in which the resin tablets are respectively set, to the feeding table
244
; a degating unit
251
removing disused resin from molded products, which are taken out from the molding die
241
; a product accommodating unit
253
having accommodating magazines
252
, in which the molded products, from which the disused resin is removed, are accommodated; and a control unit
254
controlling the whole machine.
When the work pieces and the resin tablets are supplied onto the feeding table
244
, they are held by a loader
255
and conveyed to the molding die
241
, which has been opened. On the other hand, when the molded products are ejected from the molding die
241
, they are held by an unloader
256
and conveyed to the degating unit
251
. At that time, the unloader
256
cleans parting faces of the molding die
241
. The unloader
266
holds and presses substrates of the molded products, and they are cooled by air so as to prevent deformation of the substrates in the degating unit
251
. In the degating unit
251
, the substrates are twisted to remove the disused resin, so the unloader
256
leaves the molded products, from which the disused resin is removed, and returns to take out next products. The loader
255
and the uunloader
256
are moved along a common guide rail
257
, which is provided above the press unit
242
. Namely, the loader
255
is reciprocatively moved between the feeding table
244
and the molding die
241
; the unloader
256
is reciprocatively moved between the molding die
241
and the degating unit
251
.
In
FIG. 23
, the release fil

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