4. Plastic and nonmetallic article shaping or treating: processes
  5. Direct application of fluid pressure differential to...
  6. Producing multilayer work or article

Apic Yamada Corporation

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Apparatus for sealing a semiconductor device utilizing a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Compression molding machine

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Reexamination Certificate

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Method of manufacturing semiconductor devices and resin...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate

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Method of resin molding

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Reexamination Certificate

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Resin molding machine

Plastic article or earthenware shaping or treating: apparatus – With interposed non-adhering web or sheet type parting means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2483930

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