Resin molded semiconductor device

Details Resin molded semiconductor device Resin molded semiconductor device

2008-02-27

2010-11-09

Nguyen, Thinh T (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S701000, C257S702000, C257SE23010, C438S126000, C438S127000

Reexamination Certificate

active

07830023

ABSTRACT:
A semiconductor device includes a circuit board, a wiring part, a protective coating glass, and a resin part. The circuit board has an approximately rectangular shape. The protective coating glass is disposed on the circuit board and is arranged on an inside of the circuit board in such a manner that an outer-peripheral end of the protective coating glass is away from each of four sides of the circuit board at a first distance and is away from each of four corners of the circuit board at a second distance that is larger than the first distance. The resin part seals the circuit board, the wiring part, and the protective coating glass in such a manner that an outer-peripheral end portion of the circuit board that is located on an outside of the protective coating glass directly contact with the resin part.

REFERENCES:
patent: 4087314 (1978-05-01), George et al.
patent: 1-261850 (1989-10-01), None

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