Resin-encapsulation semiconductor device and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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Details

C438S106000, C438S112000, C438S123000

Reexamination Certificate

active

07338838

ABSTRACT:
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.

REFERENCES:
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6166430 (2000-12-01), Yamaguchi
patent: 6204553 (2001-03-01), Liu et al.
patent: 6400004 (2002-06-01), Fan et al.
patent: 6501156 (2002-12-01), Nakanishi et al.
patent: 6638790 (2003-10-01), Minamio et al.
patent: 6642609 (2003-11-01), Minamio et al.
patent: 6650020 (2003-11-01), Yamada et al.
patent: 2003/0127711 (2003-07-01), Kawai et al.
patent: 2004/0089921 (2004-05-01), Minamio et al.
patent: 2005/0110121 (2005-05-01), Minamio et al.
patent: 08250641 (1996-09-01), None
patent: 11-195733 (1999-07-01), None
patent: 11-214606 (1999-08-01), None
patent: 2000-012758 (2000-01-01), None
patent: 2001-345411 (2001-12-01), None

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