Resin encapsulation molding method for semiconductor device

Details Resin encapsulation molding method for semiconductor device Resin encapsulation molding method for semiconductor device

2005-07-14

2008-10-21

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S127000

Reexamination Certificate

active

07439101

ABSTRACT:
According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which the semiconductor device is mounted is prepared and then the device-mounted substrate is set in one mold part. A release film is thereafter provided between the device-mounted substrate and the other mold part opposite to that one mold part. The one and other mold parts are then closed to press the release film against the portion of the semiconductor device. The device-mounted substrate has a projection enclosing the portion of the semiconductor device for preventing resin flash from being formed. When the mold parts are closed, the release film is pressed against the projection to allow the projection to dig into the release film.

REFERENCES:
patent: 6344162 (2002-02-01), Miyajima
patent: 6554598 (2003-04-01), Tsuruta
patent: 6613180 (2003-09-01), Sunagawa et al.
patent: 6770236 (2004-08-01), Miyajima
patent: 6900508 (2005-05-01), Chiu et al.
patent: 6978540 (2005-12-01), Morganelli et al.
patent: 2002/0164391 (2002-11-01), Shinma
patent: 2002-059453 (2002-02-01), None
patent: 2002-254481 (2002-09-01), None
patent: 2004-119410 (2004-04-01), None
patent: 2004-119816 (2004-04-01), None

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