Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent
1996-04-25
1997-07-08
Nguyen, Khanh P.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Opposed registering coacting female molds
425117, 425121, 425544, 425572, 425588, 425DIG47, 26427217, B29C 4502, B29C 4514, B29C 4537
Patent
active
056458649
ABSTRACT:
A resin encapsulating molding die for manufacturing a semiconductor device includes a cavity piece having a cavity on which a lead frame with a mounted semiconductor element may be placed, with the semiconductor element in the cavity, and a gate piece having a gate portion including a sub-runner through which a molten resin for encapsulating the semiconductor element is introduced into the cavity, the gate piece being detachable from the cavity piece. The molding die also includes a sealing dam disposed adjacent the sub-runner for blocking flow of molten resin from the sub-runner toward leads of the lead frame. The sealing dam may be a clamp structure for clamping the leads closest to the gate portion, the sealing dam and cavity piece may be a continuous unitary structure, and the sealing dam may have a parting surface substantially coplanar with a parting surface of the cavity piece.
REFERENCES:
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 5214846 (1993-06-01), Asami et al.
patent: 5302101 (1994-04-01), Nishimura
Mitsubishi Denki & Kabushiki Kaisha
Nguyen Khanh P.
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