Resin-encapsulated semiconductor memory device useful for single

Details Resin-encapsulated semiconductor memory device useful for single Resin-encapsulated semiconductor memory device useful for single

1991-03-26

1994-02-15

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257692, 257696, 257773, 257787, 174 524, 361813, 365 51, H01L 2348, H01L 2944, H01L 2710, H02G 308

Patent

active

052870006

ABSTRACT:
According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages. In accordance with another aspect of the invention, a resin-encapsulated semiconductor device of the ZIP structure is provided in which a semiconductor pellet having a plurality of external terminals disposed on a device-forming surface along each side of the planar shape is encapsulated with a resin, wherein inner leads for signals connected electrically with external terminals, disposed opposing to the surface of the resin-encapsulated portion disposed with outer leads and disposed along the most remote side of the semiconductor pellet, are arranged so as to overlap the semiconductor pellet.

REFERENCES:
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 5097440 (1992-03-01), Konishi et al.

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