Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2005-01-25
2005-01-25
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S792000, C257S793000
Reexamination Certificate
active
06847125
ABSTRACT:
The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.
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Isoda Keiko
Ogata Kiyoshi
Tanaka Jun
Clark Jasmine
Mattingly Stanger & Malur, P.C.
Renesas Technology Corp.
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