Resin composition and thermo/photosensitive composition

Details Resin composition and thermo/photosensitive composition Resin composition and thermo/photosensitive composition

2003-08-12

2009-08-04

Lee, Sin J. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S905000, C430S906000, C430S910000, C430S916000

Reexamination Certificate

active

07569328

ABSTRACT:
The present invention provides a resin composition that includes (A) a polymer compound that has, on a side chain of a main chain polymer, through a linkage group containing a hydrogen-bonding group and a ring structure, a terminal ethylenic unsaturated bond, and is soluble or swelling in water or an alkali aqueous solution, and (B) a compound that generates radicals when exposed to light or heat. The invention further provides a thermo/photosensitive composition that includes (A′) a polymer compound that has a non-acidic hydrogen-bonding group on a side chain and is soluble or swelling in water or an alkali aqueous solution, and (B′) a compound that generates radicals when exposed to light or heat.

REFERENCES:
patent: 2850445 (1958-09-01), Oster
patent: 4708925 (1987-11-01), Newman
patent: 6569603 (2003-05-01), Furukawa
patent: 2002/0086238 (2002-07-01), Fujimaki et al.
patent: 1 182 033 (2002-02-01), None
patent: 1 249 731 (2002-10-01), None
patent: 1 285 751 (2003-02-01), None
patent: 1 341 040 (2003-09-01), None
patent: 44-20189 (1969-08-01), None
patent: 64-7036 (1989-01-01), None
patent: 8-108621 (1996-04-01), None
patent: 8-276558 (1996-10-01), None
patent: 9-34110 (1997-02-01), None
patent: 10-207056 (1998-08-01), None
patent: 11-65105 (1999-03-01), None
patent: 2000-89455 (2000-03-01), None
patent: 2002-040652 (2002-02-01), None
patent: 2002-156757 (2002-05-01), None
patent: 2002-182391 (2002-06-01), None
Chemical Abstract (AN 1998:505254)—English abstract for JP10-207056.
Chemical Abstract (AN 1989:448172)—English abstract for JP 64-7036 (JP 01007036).
Japanese Patent Office Action dated Nov. 11, 2008 for Japanese Patent Application No. 2002-237509 and English language translation thereof.

Affiliated with

Also associated with

Rating

Resin composition and thermo/photosensitive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin composition and thermo/photosensitive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition and thermo/photosensitive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4118713