Resin composition and solder resist composition

Details Resin composition and solder resist composition Resin composition and solder resist composition

1991-10-11

1993-06-01

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430283, 430285, 522102, 522109, G03F 7033

Patent

active

052158632

ABSTRACT:
Disclosed herein is a resin composition or a solder resist resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photopolymerization initiator (E).

REFERENCES:
patent: 3887450 (1975-06-01), Gilano et al.
patent: 3989610 (1976-11-01), Tsukada et al.
patent: 4017453 (1977-03-01), Heilman et al.
patent: 4601973 (1986-07-01), Bauer
WPIL, File Supplier, AN=88-054495, Derwent Publications Ltd., London, GB; (Mitsui Toatsu), Jan. 19, 1988.
WPIL, File Supplier, AN=86-116103, Derwent Publications Ltd., London, GB; (Mitsubishi), Mar. 22, 1986.
WPIL, File Supplier, AN=87-154194 Derwent Publications Ltd., London, GB; (Daicel), Apr. 27, 1987.

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