Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Patent
1994-10-17
1996-08-06
Carrillo, Ana L.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
525425, 525436, C08L 5902, C08L 6702
Patent
active
055434746
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to a novel resin composition which is excellent in heat resistance, mechanical strengths and melt moldability.
TECHNICAL BACKGROUND
Aromatic polyamideimide resins are plastic materials excellent in heat resistance, mechanical strengths, electrical properties and chemical resistance, and have been so far used as varnishes, films, etc. An aromatic polyamideimide resin is produced typically by a method in which an aromatic tricarboxylic acid anhydride and a diisocyanate are reacted in a solvent or a method in which an aromatic tricarboxylic acid anhydride halide and a diamine are reacted in a solvent. However, the polyamideimide resins produced by these methods are, though suitably used in the preparation of varnishes, cast films, etc., not suitable for use in melt molding including injection molding because of its inferior melt moldability.
In the specification of U.S. Pat. No. 4,313,868, there is proposed a copolyamideimide for use in injection-molding, said copolyamideimide having the following recurring polyamideimide unit (I) and recurring polyamide unit (II), ##STR2## wherein R is a divalent aromatic hydrocarbon radical having about 6 to about 20 carbon atoms or a divalent hydrocarbon which is bound to a group selected from the group consisting of --O--, methylene, --CO-- and --SO.sub.2 -- either directly or via a stable linkage, and X is a divalent aromatic radical, the unit (I):unit (II) molar ratio being 80:20 to 20:80.
Compared to a polyamideimide resin free of the recurring unit (II), the above copolyamideimide has improved melt moldability, but a flow starting time in melt-molding of the copolyamideimide is close to a decomposition temperature in melting of the copolyamideimide, so that good molding of the copolyamideimide remains unachieved.
Japanese Laid-open Patent Application (Kokai) No. 59-8,755 (8,755/1984) proposes an abrasion-resistant resin molding material comprising an intimate mixture of sulfide resin, a polyamide resin and an aromatic polyester resin which have better flowability than the polyamideimide resin.
The above polyamideimide resin (a) is an aromatic polymer which has 30 to 100 mol % of a recurring unit represented by the formula (III), ##STR3## and which may have less than 70 mol % of a polyamide unit represented by the formula (IV). ##STR4## Ar in the formula (III) is a trivalent aromatic group containing at least one 6-membered carbon ring. R in the formulas (III) and (IV) is a divalent aromatic group and/or a divalent aliphatic group. Ar' in the formula (IV) is a divalent aromatic or aliphatic group containing at least one 6-membered carbon ring.
In this document, it is described that at least one member of the resin (c) selected from the polyphenylene resin, the polyamide resin and the aromatic polyester resin is contained in the molding material as a good fluidity imparting agent.
However, said document neither discloses nor suggests this invention.
DISCLOSURE OF THE INVENTION
It is an object of this invention to provide a novel resin composition containing a polyamideimide resin and a polyester resin as main components.
Another object of this invention is to provide a novel resin composition containing a polyamideimide resin and a polyphenylene sulfide resin as main components.
Still another object of this invention is to provide a novel resin composition containing a polyamideimide resin and a liquid crystal polymer as main components.
The other object of this invention is to provide a resin composition which has a good balance among a heat resistance, mechanical properties and a flowability.
In accordance with this invention, the following resin composition is provided to achieve the aforesaid objects of this invention.
That is, in accordance with this invention, there is first provided a resin composition which comprises: unit represented by the formula (1) and 5 to 95 mol % of at least any one of a recurring unit represented by the formula (2) and a recurring unit represented by the formula (3), provided that the total
REFERENCES:
patent: 4313868 (1982-02-01), Hanson
patent: 4340697 (1982-07-01), Aya et al.
patent: 4614782 (1986-09-01), Nishizawa et al.
patent: 5236988 (1993-08-01), Doyama et al.
Abstract of JP-3 181560, "Aromatic Poly(Amide/Imide) Resin Composition", Aug. 7, 1991.
Amagai Akikazu
Ban Hajime
Harada Hidefumi
Kawaki Takao
Takeda Yuji
Carrillo Ana L.
Mitsubishi Gas Company, Inc.
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