Resin composition

Details Resin composition Resin composition

2007-06-05

2007-06-05

Choi, Ling-Siu (Department: 1713)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S325000, C430S326000, C430S170000, C430S330000, C430S054000, C430S921000

Reexamination Certificate

active

10618068

ABSTRACT:
The present invention relates to a resin composition comprising: an alkali-soluble resin (A); an infrared absorbing agent (B); and a thiol compound (C), wherein a solubility thereof in an alkaline aqueous solution is changed by exposure with a infrared laser ray, and a positive or negative-type image recording layer containing the resin composition.

REFERENCES:
patent: 4436805 (1984-03-01), Iguchi et al.
patent: 54-092526 (1979-07-01), None
patent: 07-285275 (1995-10-01), None
patent: 11-020318 (1999-01-01), None
patent: 2000-241966 (2000-09-01), None

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