Residue removal by supercritical fluids

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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C03C 2300

Patent

active

059085100

ABSTRACT:
A method for the removal of residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to a supercritical fluid or liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the precision surface. Cryogenic aerosol may be used in conjunction with either the supercritical fluid or liquid CO.sub.2.

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