Replication and transfer of microstructures and nanostructures

Details Replication and transfer of microstructures and nanostructures Replication and transfer of microstructures and nanostructures

2004-10-27

2008-03-18

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S695000, C438S780000, C257SE21029, C257SE21091, C257SE21109, C257SE21134

Reexamination Certificate

active

07345002

ABSTRACT:
A method for the duplication of microscopic patterns from a master to a substrate is disclosed, in which a replica of a topographic structure on a master is formed and transferred when needed onto a receiving substrate using one of a variety of printing or imprint techniques, and then dissolved. Additional processing steps can also be carried out using the replica before transfer, including the formation of nanostructures, microdevices, or portions thereof. These structures are then also transferred onto the substrate when the replica is transferred, and remain on the substrate when the replica is dissolved. This is a technique that can be applied as a complementary process or a replacement for various lithographic processing steps in the fabrication of integrated circuits and other microdevices.

REFERENCES:
patent: 5629579 (1997-05-01), Zimmerman
patent: 6518194 (2003-02-01), Winningham et al.
patent: 6656568 (2003-12-01), Winningham et al.
patent: 6744909 (2004-06-01), Kostrzewski et al.
patent: 7125639 (2006-10-01), Schaper

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