Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-12-13
1987-10-06
Hruskoci, Peter
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156633, 1566591, 156662, 357 32, 357 55, 357 60, H01L 21306, B44C 122
Patent
active
046981314
ABSTRACT:
An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.
In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.
REFERENCES:
patent: 4182025 (1980-01-01), Wickenden
patent: 4467342 (1984-08-01), Tower
patent: 4604161 (1986-08-01), Araghi
Araghi Mehdi N.
Tandon Jagdish C.
Hruskoci Peter
McMullen Frederick E.
Xerox Corporation
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