Repetitive circumferential milling for sample preparation

Radiant energy – Inspection of solids or liquids by charged particles – Methods

Reexamination Certificate

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C250S304000, C250S306000, C250S309000, C250S310000, C250S251000, C250S424000, C250S441110, C250S3960ML, C250S492210, C250S492200, C250S492220, C250S39600R, C430S005000, C430S296000, C428S141000, C438S800000, C216S002000

Reexamination Certificate

active

07442924

ABSTRACT:
A method of sample extraction entails making multiple, overlapping cuts using a beam, such as a focused ion beam, to create a trench around a sample, and then undercutting the sample to free it. Because the sidewalls of the cut are not vertical, the overlapping cuts impinge on the sloping sidewalls formed by previous cuts. The high angle of incidence provides a greatly enhanced mill rate, so that making multiple overlapping cuts to produce a wide trench can requires less time than making a single, deep cut around the perimeter of a sample.

REFERENCES:
patent: 4936968 (1990-06-01), Ohnishi et al.
patent: 5270552 (1993-12-01), Ohnishi et al.
patent: 5435850 (1995-07-01), Rasmussen
patent: 5851413 (1998-12-01), Casella et al.
patent: 6140652 (2000-10-01), Shlepr et al.
patent: 6420722 (2002-07-01), Moore et al.
patent: 6538254 (2003-03-01), Tomimatsu et al.
patent: 6570170 (2003-05-01), Moore
patent: 6664552 (2003-12-01), Shichi et al.
patent: 6781125 (2004-08-01), Tokuda et al.
patent: 6870161 (2005-03-01), Adachi et al.
patent: 2002/0121614 (2002-09-01), Moore
patent: 2002/0166976 (2002-11-01), Sugaya
patent: 2004/0144924 (2004-07-01), Asselbergs et al.
patent: 2006/0000973 (2006-01-01), Tappel
patent: 2006/0017016 (2006-01-01), Tappel
Claves, S.R., et al., Using a FIB to investigate the 3d Morphology of B-AlFeSi Intermetallic Particles, Materials Forum, 2004, pp. 1334-1340, vol. 28, Institute of Materials Engineering, Australasia, Ltd.
Miller, M.K., et al., Strategies for fabricating atom probe specimens with a dual beam FIB, Ultramicroscopy (available online Nov. 20, 2004), 102 (2005), pp. 2878-298.
Tseng, A.A., Recent developments in micromilling using focused ion beam technology, J. Micromech Microeng., Jan. 14, 2004, pp. R15-R34, v. 14.
Tseng, A.A., Recent developments in micromilling using focused ion beam technology, J. Micromech Microeng., Jan. 14, 2004, pp. R-15-R34, v. 14.

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