Repatterned integrated circuit chip package

Details Repatterned integrated circuit chip package Repatterned integrated circuit chip package

2005-02-28

2008-10-14

Doan, Theresa T. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S697000, C257SE27016

Reexamination Certificate

active

07436052

ABSTRACT:
A repatterned integrated circuit chip package which balances and/or reduces the package capacitance associated with the gain resistor terminals to reduce the degradation of common mode rejection with frequency.

REFERENCES:
patent: 4714067 (1987-12-01), Staerzl
patent: 5075633 (1991-12-01), Bowers
patent: 5790295 (1998-08-01), Devon
patent: 6445603 (2002-09-01), Abedifard

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