Repatterned integrated circuit chip package

Details Repatterned integrated circuit chip package Repatterned integrated circuit chip package

2005-04-05

2005-04-05

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S697000

Reexamination Certificate

active

06876070

ABSTRACT:
A repatterned integrated circuit chip package which balances and/or reduces the package capacitance associated with the gain resistor terminals to reduce the degradation of common mode rejection with frequency.

REFERENCES:
patent: 5075633 (1991-12-01), Bowers
patent: 6445603 (2002-09-01), Abedifard

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