Repairable semiconductor multi-package module having individuali

Details Repairable semiconductor multi-package module having individuali Repairable semiconductor multi-package module having individuali

1992-05-04

1994-01-18

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257724, 257685, 257698, H01L 2316, H01L 2328, H01L 2302, H01L 2312

Patent

active

052801934

ABSTRACT:
A semiconductor multiple package module (10) on a PCB material substrate (18) is provided, wherein semiconductor dice are directly mounted onto the PCB material substrate (18) thereby eliminating a subsequent board mounting at the customer level. A plurality of semiconductor dice are mounted and electrically connected to a plurality of circuit traces (22) on the PCB material substrate (18) having a plurality of edge connectors (20). The plurality of circuit traces (22) has conductive paths to electrically interconnect the semiconductor dice to the edge connectors (20) and to each other. The semiconductor dice are directly overmolded on the PCB material substrate (18) with a molding compound to form individual semiconductor devices (12, 14, and 16) having separate package bodies. The individualized package bodies enable repair to the module by making removal of only nonfunctional semiconductor devices from the PCB material substrate (18) possible.

REFERENCES:
patent: 4672421 (1987-06-01), Lin
patent: 4677528 (1987-06-01), Miniet
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 4992849 (1991-02-01), Corbett et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5130780 (1992-07-01), Kumai et al.
patent: 5191404 (1993-03-01), Wu et al.

Affiliated with

Also associated with

Rating

Repairable semiconductor multi-package module having individuali does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Repairable semiconductor multi-package module having individuali, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Repairable semiconductor multi-package module having individuali will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1138034