Removing whisker defects

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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Reexamination Certificate

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11169176

ABSTRACT:
A method of removing a defect from a gate stack on a substrate, comprises treating the gate stack with a plasma. The plasma comprises fluorine, the gate stack comprises a gate layer and a metallic layer, and substantially no photoresist is present on the substrate.

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S. Wolf and R.N. Tauber, (Silicon Processing for the VLSI Era, vol. 1- Process Technology, Lattice Press, 1986, p. 384)□□.
Encyclopedia of Chemical Technology, Kirk-Othmer, vol. 14, pp. 677-709, (1995).

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