Removing slurry residue from semiconductor wafer planarization

Details Removing slurry residue from semiconductor wafer planarization Removing slurry residue from semiconductor wafer planarization

1991-10-15

1994-06-14

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

51281R, 51283R, 134 33, 134902, 437228, H01L 21304

Patent

active

053207068

ABSTRACT:
Polish slurry particles remaining on a semiconductor wafer after mechanical planarization are removed from the semiconductor wafer by polishing the wafer with a polishing pad while a mixture of deionized water and a surfactant is applied to the wafer and the pad.

REFERENCES:
patent: 3841031 (1974-10-01), Walsh
patent: 3979239 (1976-09-01), Walsh
patent: 4050954 (1977-09-01), Basi
patent: 4116714 (1978-09-01), Basi
patent: 4129457 (1978-12-01), Basi
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4910155 (1990-03-01), Cote et al.
Rodel Surfacetech Review, vol. 1, Issue 2, Mar. 1987, pp. 1-4.

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