Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Finishing or perfecting composition or product
Patent
1999-12-02
2000-09-12
Baxter, Janet
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Finishing or perfecting composition or product
510176, 134 13, G03F 742, C11D 708
Patent
active
061176230
ABSTRACT:
While it is important in the photolithographic patterning of a photoresist layer on a substrate surface for the manufacture of various electronic devices that the pattern-wise light exposure of the photoresist layer is preceded by partial removal of the photoresist layer on the non-patterning areas such as marginal areas, peripheral areas and back surface opposite to the surface for resist patterning by dissolving away the extraneous photoresist layer with a remover solvent, the invention proposes an improvement in the partial removal of the photoresist layer by using a specific organic solvent or solvent mixture selected relative to the surface tension of the solvent which, in particular, is a mixture of .gamma.-butyrolactone and anisole in a mixing ratio of 70:30 to 97:3 by weight.
REFERENCES:
patent: 5268260 (1993-12-01), Bantu et al.
patent: 5571417 (1996-11-01), Bhatt et al.
patent: 5849467 (1998-12-01), Sato et al.
patent: 5849487 (1998-12-01), Sato et al.
patent: 5866305 (1999-02-01), Chon et al.
Fukushima Hidehito
Koshiyama Jun
Shimai Futoshi
Ashton Rosemary
Baxter Janet
Tokyo Ohka Kogyo Co. Ltd.
LandOfFree
Remover solvent for partial removal of photoresist layer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Remover solvent for partial removal of photoresist layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Remover solvent for partial removal of photoresist layer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-94333