Removal of fluorine or chlorine residue by liquid CO.sub.2

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 6, 134 7, 134 10, 134 254, 134 36, 134902, 451 36, 451 37, 451 38, 451 39, 451 75, 451102, B08B 304

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active

059762640

ABSTRACT:
A method for the removal of fluorine or chlorine residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the precision surface. Cryogenic aerosol may be used in conjunction with liquid CO.sub.2.

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