Removal of carbon-based polymer residues with ozone, useful in t

Details Removal of carbon-based polymer residues with ozone, useful in t Removal of carbon-based polymer residues with ozone, useful in t

1992-06-15

1995-05-23

Walsh, Donald P.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

20415715, 42218604, 42218605, 422906, 110236, 134 1, H05H 124

Patent

active

054178266

ABSTRACT:
A method for removing carbon-based polymer residues to effect a cleaning of a reactor, such as a planar plasma reactor, by exciting an ozone containing atmosphere in the reactor, which atmosphere is reactive with the carbon-based residues thereby forming volatile end products, which end products can be evacuated from the reactor.

REFERENCES:
patent: 4341592 (1982-07-01), Shortes et al.
patent: 4721664 (1988-01-01), Shimizu et al.
patent: 4820377 (1989-04-01), Davis et al.
patent: 4854263 (1989-08-01), Chang et al.
patent: 4859304 (1989-08-01), Cathey et al.
patent: 4872947 (1989-10-01), Wang et al.
patent: 4885047 (1989-12-01), Ury et al.
patent: 4892753 (1990-01-01), Wang et al.
patent: 4960488 (1990-10-01), Law et al.
patent: 5044314 (1991-09-01), McNeilly
patent: 5158644 (1992-10-01), Cheung et al.
patent: 5215592 (1993-01-01), Jackson
patent: 5261966 (1993-11-01), Mashimo et al.
patent: 5281302 (1994-01-01), Gabric et al.
patent: 5356478 (1994-10-01), Chen et al.
Daniel L. Flamm, Dry Plasma Resist Stripping Part I: Overview of Equuipment, Solid State Technology, Aug. 1992, pp. 37-39.

Affiliated with

Also associated with

Rating

Removal of carbon-based polymer residues with ozone, useful in t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Removal of carbon-based polymer residues with ozone, useful in t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removal of carbon-based polymer residues with ozone, useful in t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2137962