Reloading of die carriers without removal of die carriers...

Details Reloading of die carriers without removal of die carriers... Reloading of die carriers without removal of die carriers...

2007-12-04

2007-12-04

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C257SE21522, C257SE21533

Reexamination Certificate

active

10940288

ABSTRACT:
A method of testing microelectronic dies is described. A respective set of dies is inserted into die carrier bodies releasably held within a set of sockets secured to a burn-in board. A set of die carrier covers is closed, each die carrier cover being secured to a respective die carrier body and closing over a respective die. The burn-in board is then inserted into a burn-in oven. Burn-in testing of the dies is then carried out while in the burn-in oven. The burn-in board is then removed from the oven. The die carrier covers are then opened. The dies are removed from the die carrier bodies without removing the die carrier bodies from the sockets. The process is then repeated with subsequent sets of dies.

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