Relative lateral motion in linear CMP

Details Relative lateral motion in linear CMP Relative lateral motion in linear CMP

2005-05-31

2005-05-31

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S041000, C451S059000, C451S168000, C451S304000, C451S307000, C451S311000

Reexamination Certificate

active

06899594

ABSTRACT:
Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a wafer. A belt polish module comprises a linear CMP belt forming a loop around an idle roller and a drive roller, first and second pistons engaging, respectively, first and second ends of the idle roller, and a controller configured to vary the forces applied by the first and second pistons to the ends of the idle roller in order to laterally translate the linear CMP belt. A method for linear CMP comprises rotating a wafer about a vertical axis, contacting the rotating wafer against a linear CMP belt moving in a longitudinal direction, and causing a relative lateral motion between the rotating wafer and the linear CMP belt.

REFERENCES:
patent: 5830046 (1998-11-01), Dugger et al.
patent: 6001004 (1999-12-01), Botteghi
patent: 6336851 (2002-01-01), Shendon
patent: 6471568 (2002-10-01), Wang
patent: 6722966 (2004-04-01), Wang
patent: 6746320 (2004-06-01), Krusell et al.

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