Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
1998-10-06
2001-11-13
Williams, Alexander O. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S673000, C257S644000, C257S684000, C257S794000, C257S712000, C257S787000
Reexamination Certificate
active
06316829
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to semiconductor devices, and more particularly to molded semiconductor packages reinforced to prevent package warping.
BACKGROUND OF THE INVENTION
Semiconductor packages which have encapsulant-rich areas have a tendency to warp due to shrinkage of the encapsulant. After encapsulation, the inner encapsulant material is often hotter than the material on the surface of the package. This results in contraction of the hotter material which pulls the surface toward it, causing deformation, and often in the form of package warpage. Contraction of the material resultant warpage induces high internal stress. Thin integrated circuit packages are especially susceptible to warping after the encapsulation/molding process. This is particularly true for thin surface mount packages. Warped surface mount packages are rejected since the warpage causes some of the leads to deflect from the mounting plane of the leads causing uneven lead planarity.
SUMMARY OF THE INVENTION
A reinforced semiconductor package and method utilizes at least one of grooves and ridges formed on the package body to reinforce a thin package body to prevent warping of the package after molding or package formation. In one embodiment, grooves are formed in the surface of the package body, and in another embodiment ridges are formed on the surface of the package body. A combination of grooves and ridges may be used to reinforce the package body.
REFERENCES:
patent: 5309026 (1994-05-01), Matsumoto
patent: 5466887 (1995-11-01), Hasegawa
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patent: 5-063111 (1993-03-01), None
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Boon Suan-Jong Jae
Goh Jing Sua
Brady III Wade James
Garner Jacqueline J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Williams Alexander O.
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