Regenerative copper etching process and solution

Details Regenerative copper etching process and solution Regenerative copper etching process and solution

1984-08-20

1985-10-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 252 792, C23F 100, B44C 122, C03C 1500

Patent

active

045458502

ABSTRACT:
Process and solution for etching copper and other metals, wherein the etching solution is regenerated and the copper or other metal is recovered in a relatively pure and useful form. The metal is contacted with an aqueous solution of nitric acid to dissolve the metal and form a nitrate of the metal, and sulfuric acid is added to the solution to convert the nitrate to nitric acid and a precipitate of the metal.

REFERENCES:
patent: 2172171 (1939-09-01), Meyer et al.
patent: 4482425 (1984-11-01), Battey

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