Regeneration of copper etch bath

Details Regeneration of copper etch bath Regeneration of copper etch bath

1987-04-13

1989-11-14

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 252 792, 252 794, 23300, 23305R, C09K 1306, C23F 100

Patent

active

048804959

ABSTRACT:
This invention relates to a copper etching process which involves contacting the copper with an aqueous etching solution comprising sulfuric acid and a peroxide to which is added less than about 0.2% of an organic additive useful as a crystallization control agent and selected from the group consisting of a low molecular weight glycol and gum arabic. With this compound present, copper sulfate crystals do not adhere to the tank and removal of the crystals from the bath is facilitated.

REFERENCES:
patent: 3556883 (1971-01-01), Naito et al.
patent: 3773557 (1973-11-01), Shibasaki et al.
patent: 4141850 (1979-02-01), Readio et al.

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