Refractory oxide fabrication

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156644, 156646, 156654, 156657, 156667, B44C 122, C03C 1500, C03C 2506, C23F 102

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active

043572022

ABSTRACT:
Refractory oxide materials, for example, Al.sub.2 O.sub.3 (sapphire) and Al.sub.2 MgO.sub.4 (spinel) can be shaped to precise dimensions by using a preformed member having a higher melting temperature than the oxide in the outline of the desired shape placed in contact with the refractory oxide and subjecting the combination to a temperature between 1500.degree. C. and the melting temperature of the oxide in the presence of a forming gas atmosphere containing an inert gas and approximately 15% hydrogen. The refractory oxide is etched over the area of contact.

REFERENCES:
patent: 4008111 (1977-02-01), Rutz
patent: 4038117 (1977-07-01), Noble et al.
patent: 4098917 (1978-07-01), Bullock et al.
IBM Technical Disclosure Bulletin, vol. 18, No. 12, May 1976, Selective Etching of Sapphire by R. F. Rutz, pp. 4185-4186.
Dushman-Vacuum Technology, 4th Edition, pp. 765-767.
Journal of Electrochemical Society, vol. 126, No. 6, Jun. 1979, pp. 1004-1008.

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