Reflow soldering method and a reflow soldering furnace

Details Reflow soldering method and a reflow soldering furnace Reflow soldering method and a reflow soldering furnace

1998-07-28

2000-10-24

Ryan, Patrick

Metal fusion bonding

Process

Specific mode of heating or applying pressure

219255, 219422, 228 42, B23K 3102, B23K 100, B23K 500, D06E 7524, F27B 1400

Patent

active

061353442

ABSTRACT:
A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.

REFERENCES:
patent: 5039841 (1991-08-01), Kato et al.
patent: 5154338 (1992-10-01), Okuno et al.
patent: 5347103 (1994-09-01), LeMieux
patent: 5364007 (1994-11-01), Jacobs et al.
patent: 5567151 (1996-10-01), Mizoguchi et al.
patent: 5942842 (1999-08-01), Fogle, Jr.

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