4. Metal fusion bonding
  5. Process
  6. Specific mode of heating or applying pressure

Taro Matsuoka

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Reflow soldering method

Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate

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Reflow soldering method and a reflow soldering furnace

Metal fusion bonding – Process – Specific mode of heating or applying pressure
Patent

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Profile ID: LFUS-PAI-P-1764810

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